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Sub categories of Electronic
Antennas & RF Systems
EMS-electronic manufacturing services
Embedded Rugged Computers
Board Level EMI/RFI Shielding
Laser illuminators
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Flex and multi-flex boards
Flex and multi-flex boards
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Flex-rigid boards
Flex-rigid boards
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Teflon and hybrid boards
Teflon and hybrid boards
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HDI
Product | From Israel 
Exporter, Manufacturer, Supplier
  Including buried and blind via holes. MICROVIA   Less than 0.1 mm between layer 1 and 2.     Also available between layer 1 and 3,2 and 4,2 and 3,3 and 4.    Aspect ratio up to 1:1  Conductor trace - 3 mil   Space between conductor trace - 3 mil   
Rigid multilayer boards up to 36 layers
Product | From Israel 
Exporter, Manufacturer, Supplier
Rigid multilayer boards up to 36 layers   16-layer rigid board with blind vias for medical  diagnostic equipment.  Rigid multi layer for telecom application.  
Polishing Department
Service | From Israel 
Exporter, Manufacturer, Supplier
Polishing Department: The department has a full automatic polishing machine, having several polishing options by a number of polishing bands and scratch removers, in addition to other machines and tools for scratches removal from the material surface.
Engineering and Development Department
Service | From Israel 
Exporter, Manufacturer, Supplier
The company’s experienced engineers are very knowledgeable and experienced in the fields of sheet metal processing and integration to electronic parts and metal. All customer requirements are processed by the company’s engineers, with full collaboration and according to the customer’s preferences, the design process is performed using SOLID WORKS CAD software and enables the creation of a comprehensive product file including modeling and detailed drawings. The factory’s Engineering Department was designed to address every and all customer needs.
Teflon and hybrid boards
Product | From Israel 
Exporter, Manufacturer, Supplier
Teflon TM and hybrid boards 12-layer hybrid board, built with 2 layers of "Duroid" Teflon TM as microstrip and 10    layers of polyimide.    Application: Microwave.   14-layer antenna board (Duroid) - ceramic  based Teflon™ combined with Getek     trademarks laminate and prepreg.    Application: RF Microwave.  
Special solutions for heat distribution
Technology | From Israel 
Exporter, Manufacturer, Supplier
Internal and external heat sinks, 3D heatsink, copper-Invar-copper,     heavy copper inner layer, etc. 16-layer polyimide PCB with heavy copper ground layers (12oz) for     extrathermal dissipation. The heavy copper ground layers  are exposed at the edge    of the PCB for attachment to cold plate assemblies. The  12oz. copper acts as both    heatsink and  active layers within the PCB.   Two 12-layer boards, laminated with copper-nickel.     Heat-sink between them. Each 12-layer board has blind/burried vias.     Application: Avionics.    16-layer rigid polyimide PCB with 0.4 mm copper ground and VCC layers.    Application: Electro-optic.     12-layer polyimide board with 3-dimensional external aluminium heat sink.
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